VOLUME 52 – 2010
FEBRUARY 2010 – Vol 52 No 2
CONTENTS
Comment, by Dr W E Gardner
NEWSDESK: Non-contact sensors measure thickness and flatness of solar glass panels; Petroleum industry giant gives nod of approval to digital CR technology; White paper provides advice and guidance on the condition monitoring of rolling bearings; Advanced IR camera saves time and money
for aerospace firm
Institute News
Institute Awards
SPECIAL FEATURE: CONFERENCE PAPERS
Non-destructive methods for materials' state awareness monitoring,
by P B Nagy
3D ultrasonic inspection of anisotropic aerospace components,
by C J L Lane, T K Dunhill, B W Drinkwater and P D Wilcox
Comparison of the defect detection capabilities of flash thermography and vibration excitation shearography,
by S G Pickering and D P Almond
Reconstructing the back of a defect from its mirror image,
by T D Hutt and F Simonetti
Pulsed eddy current thermography: system development and evaluation,
by J Wilson, G Y Tian, I Z Abidin, Suixian Yang and D Almond
High-resolution CT-based defect analysis and dimensional measurement,
by O Brunke
JANUARY 2010 – Vol 52 No 1
CONTENTS
Comment, by Dr G A Georgiou
NEWSDESK: What lies beneath: innovative engineering addresses costly naval maintenance issue
BINDT Awards: Nominations sought for Institute Awards
SPECIAL FEATURE: NOVEL APPLICATIONS
Non-destructive evaluation – a tool to identify genuine shaligram,
by K V Rajkumar, S Bagavathiappan, G K Sharma, G S Kumar, John Philip, C Babu Rao and T Jayakumar
Applications of adaptive fuzzy lifting wavelet transform in MFL signal processing,
by Fengzhu Ji, Shiyu Sun, Changlong Wang, Haipeng Zhang and Dongyan Liu
Dynamic properties of railway track and its components: recent findings and future research direction,
by S Kaewunruen and A M Remennikov
Optimisation of ultrasonic inspection to detect small transverse re-heat cracks on hydroprocessing reactors,
by G Zappavigna and C Pedrinzani
Application of ultrasonic iterative deconvolution technique to the case of internal defect detection in multi-layered PCB components,
by R Raišutis, O Tumšys, R Kažys and L Mažeika
The effect of probe oscillation (skew) on reflected signal amplitudes,
by J Zhang, E A Ginzel and M Moles
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