MOD purchase bond tester from Advanced NDT
11/05/2007
Advanced NDT Ltd has announced the successful completion of an order for 80 new Bondascope 300 bond testers to the Ministry of Defence (MOD).The MOD requirement was for a simple 'First Line' instrument to detect damage such as delaminations or core crush in composite structures. The equipment had to meet stringent EMC, Environmental and Explosion Proofing requirements.
The Bondascope 300 is a new instrument manufactured by NDT Systems Inc in the USA. NDT Systems has a wealth of experience in the manufacture of resonance bond testing instruments, for example the Bondascope 2100 (Laminar 2000). The new instrument uses a pitch-catch dry ultrasonic technique and features both audible and visual alarms as specified. The Bondascope has a liquid crystal graphic display which shows the waveform through the material. The alarms may be triggered by changes in the phase or the amplitude as required. The screen can also show a 'Bond Profile' mode which is a unique B-scan style presentation to easily show local anomalies, this simplifies the task for the operator.
The Bondascope 300 is the first of a family of bond testing instruments to be supplied by Advanced NDT Ltd.
"This new range of equipment complements our existing range of ultrasonic thickness gauges and flaw detectors," said Keith McLaughlin, Managing Director of Advanced NDT Ltd.
