Rugged smartphone with thermal imaging
24/07/2025
Teledyne FLIR OEM, part of Teledyne Technologies Incorporated, and Sonim Technologies, a US-based pioneer in rugged mobile solutions, have unveiled their Thermal by FLIR collaboration, bringing professional thermal imaging to the compact, rugged smartphone with the XP Pro Thermal. It features an integrated FLIR Lepton radiometric thermal camera module and the advanced MyFLIR Pro app, setting a new standard for field-ready mobile devices, it is claimed.
Designed for professionals who demand ultimate reliability in challenging environments, the XP Pro Thermal combines Sonim’s legendary rugged engineering with cutting-edge thermal capabilities. The device leverages the Qualcomm Snapdragon 7 Gen 3 processor to deliver exceptional performance and introduces game-changing features, including Teledyne FLIR’s patented MSX technology, which overlays visible-light details onto thermal images for unprecedented clarity and context. Users can also access FLIR
Thermal Studio software, enabling comprehensive inspection workflows and sophisticated data analysis for professional reporting.
The Sonim XP Pro Thermal is said to represent a new phase in the company’s ruggedised handset development. With the Lepton 3.5 and mobile software development kit (SDK), it has created what is claimed to be the ultimate carrier-adoption-ready rugged device.
The Thermal by FLIR collaboration has been instrumental in rapidly bringing this innovative solution to market, delivering the combination of 5G and advanced thermal capabilities customers need for enhanced situational awareness and decision-making.
A thermal-capable ruggedised mobile phone first, Sonim’s XP Pro Thermal is carrier-adoption ready, making it more accessible for professionals and consumers alike than ever before. Furthermore, its size and form factor make the XP Pro Thermal what is claimed to be the world’s thinnest ultra-rugged smartphone featuring a FLIR Lepton camera module while still delivering all the protection from the elements professionals expect.
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Through the Thermal by FLIR programme, collaborators gain access to advanced thermal imaging technology, accelerated development support and comprehensive go-to-market assistance. This innovative programme helps manufacturers integrate Teledyne FLIR OEM thermal camera modules while minimising development costs and speeding the time to market.
Available from carriers and distributors in Europe and South Africa in the coming months, the XP Pro Thermal will launch in other markets later in 2025.
Teledyne FLIR
www.teledyneflir.com
